CAMP Celebrates Its 20th Anniversary

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Total CAMP support approximately doubled from 1991-1999. During his tenure as "Top Cat" (the Chair of the informal association of CAT Directors), Professor Mackay led the universities' lobbying effort in Albany to stave off cancellation of the entire CAT program. With major support from CAMP's Corporate Sponsors, this effort was successful. Professor Mackay also developed and wrote the CAMP renewal proposal which resulted in the award to Clarkson of a second decade as a New York State CAT.

Distinguished University Professor S.V. Babu (Current CAMP Director)

In 1999 Professor S.V. Babu, of Clarkson's Department of Chemical Engineering, was hired as CAMP Director. He still holds this leadership position. He was also the Vice Provost for Research during 2001 - 2004 and was named a Distinguished University Professor when he relinquished that position.

Dr. William America (Second Deputy Director of CAMP)

There were also three different Deputy Directors so far. Edward P. McNamara served as Deputy Director until 2006, at which time he retired and became a consultant for CAMP. Dr. William America, who had thirty-two years of industrial experience, became the new Deputy Director for 2006. At the end of the year, he took a job at NXP because of family health reasons. In 2007, John (Jack) E. Prendergast was hired as CAMP's Deputy Director. He worked for more than 39 years in a variety of leadership positions at Ferro Corporation, a Corporate Sponsor of CAMP. Jack was one of the key contacts for the corporation's collaboration with CAMP.

John (Jack) Prendergast (Current Deputy Director of CAMP)

Some Recent Major Accomplishments

CAMP has been credited with an economic impact of $200 Million (about $28.5 per dollar of state money) on NYS companies during 2000 - 2007. Also the number of jobs created and retained by NYS companies as a result of collaborating with CAMP during this time period is 158.

There have been 22 patents and about 30 inventions. During 2006-2007, royalties to Clarkson were approximately $140,000 and are expected to grow to $500K each year in 3-4 years. There are several technology transfer success stories. They include the following companies:

Ferro Electronic Material Systems; Penn Yan, NY
NanoDynamics; Buffalo, NY
United Materials / APEX Technologies; Buffalo, NY
Woodruff Block; Parishville, NY
Ames Goldsmith; Glens Falls, NY

CAMP won three CAT Development Awards in 2005 -2007. One was with the Alfred CAT (Center for Advanced Ceramic Technology) and one was with the RPI CAT (Center for Future Energy Systems). CAMP's portion of these awards was about $2.4 million.

CAMP also received several contracts from the Army Research Office totaling more than $7 million since 2004.

CAMP/Clarkson University visits Binghamton University's Center for Advanced Microelectronics Manufacturing (CAMM), a component of the New York State Center of Excellence in Small Scale Systems Integration and Packaging Center (S3IP), and Endicott Interconnect Technologies

How is it that the Global Electronics Industry is able to continue to meet the demands of the consumer? The answer lies in continued investment by industry in Research and Development as well as Continuous Improvement Programs that are put in place at these organizations. New production methods as well as the development of new materials continue to advance technology and fuel the next advance in this industry.

Endicott Interconnect (EI), Endicott, NY is a company that is working on advanced packaging technology. This novel packaging will be required to keep new electronic products coming to the market at the same time that they are working to reduce the cost of packaging electronic devices. Most electronic devices purchased today use a rigid or fixed package to house the electronics required to produce the items purchased today.

In Endicott, NY, a consortium of institutions, including EI, are collaborating through Binghamton University's Center for Advanced Microelectronics Manufacturing (CAMM) to reduce the cost of packaging for assembling electronic devices. The goal of the research underway in this consortium is to produce packaging that can be made fast: print packages on a low cost flexible substrate at high rates of speed that can be rolled up and handled by Roll to Roll processing. The packaging being developed there will use the principles developed in the Lithograph Printing Industry.

Flexible Substrate for Electronic Packaging at Endicott Interconnect