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Clarkson University's CAMP & CMP Users Group of North America Host 20th International Symposium on Chemical-Mechanical Planarization

The 20th International Symposium on Chemical-Mechanical Planarization was jointly hosted by Clarkson University’s Center for Advanced Materials Processing (CAMP) and the CMP Users Group of North America, this summer in Lake Placid, N.Y.

CMP 1The conference provided an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in chemical-mechanical planarization technology.

More than 130 participants from high technology companies, suppliers and universities in the United States, Japan, Korea, Taiwan and Europe participated -- a new record for the symposium.

Speakers included engineers and scientists from IBM, Globalfoundries, Samsung, Ebara, Entegris, Cabot Microelectronics, Ferro, Fujimi Corporation, Hitachi Chemical Company, IMEC in Belgium and others. University speakers were from Kyushu Institute of Technology, Tokyo Institute of Technology, Shizuoka University, Yamanashi University, National Taiwan University of Science and Technology, Hebei University of Technology, Ozyegin University, Clarkson University, Bradley University, SUNY Polytechnic Institute and more.

CMP 2Chemical-mechanical planarization/polishing (CMP) is a process that uses nano-scale abrasives in a reactive chemical dispersion to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nano-level planarity -- a flat and uniformly smooth surface across 300 mm wafers, i.e., over eight orders of magnitude. CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices used daily in homes and businesses.

This technology plays a critical role in the semiconductor industry and is the only planarizing technology available for use with the interlayer dielectrics and metal films used in all forms of logic and memory devices extending down to14 nanometer feature sizes and even lower.

Distinguished University Professor S.V. Babu and other CAMP faculty are internationally recognized for expertise in this technology. During the CMP Symposium, Babu, who is the former director of CAMP, was presented an award by Clarkson President Tony Collins in honor of his years of service as CAMP director, from 1999 to 2016.

CMP 3Manabu Tsujimura, chief technology officer of Ebara Corporation in Japan, also received an award for his dedication, support, and innovative contributions to the worldwide CMP Community. He delivered one of the two keynote speeches at the CMP conference, titled "Innovation by Serendipity."

The second keynote speaker was Renhe Jia, the global slurry technology director at Cabot Microelectronics, who spoke on the "Challenges and Opportunities in a Maturing IC Marketplace."

The 2016 symposium focused on several fundamental aspects of CMP, including particle and colloidal aspects, polishing mechanisms, pad/conditioning behavior, flow characterization, copper/barrier film planarization, defects and post-polish cleaning, low-k films and integration challenges, 300 mm wafer issues and transition to 450 mm, shallow trench isolation, silicon nitride/polysilicon planarization and polishing of new channel and barrier materials, like germanium, indium phosphide, ruthenium, cobalt and silicon carbide.

Babu served as a lead organizer of the symposium, as he has for the past 19 years. Co-chairs for this CMP Symposium were Hirokuni Hiyama, Ebara, Japan; Gautam Banerjee, Air Products; Jin-goo Park, Hanyang University; Lee Cook, Recursive Systems LLC., Daniel Redfield, Applied Materials; Whonchee Lee, Micron; Matt Prince, Intel; Dinesh Koli, Globalfoundries; Raghu Patlolla, IBM; and Arthur Chen, NTUST, Taiwan. Banerjee also represented the CMP User’s Group.

For more photos of the symposium, visit .

Clarkson University educates the leaders of the global economy. One in five alumni already leads as an owner, CEO, VP or equivalent senior executive of a company. With its main campus located in Potsdam, New York, and additional graduate program and research facilities in the Capital Region and Beacon, N.Y., Clarkson is a nationally recognized research university with signature areas of academic excellence and research directed toward the world's pressing issues. Through more than 50 rigorous programs of study in engineering, business, arts, education, sciences and the health professions, the entire learning-living community spans boundaries across disciplines, nations and cultures to build powers of observation, challenge the status quo and connect discovery and innovation with enterprise.

[Photographs for media use are available at, and .]

Photo captions:

cmp1-2016.jpg: From left to right, Manabu Tsujimura, the chief technology officer of Ebara Corporation in Japan, and Clarkson Distinguished University Professor S.V. Babu display their awards, which were presented by Clarkson President Tony Collins.

cmp2-2016.jpg: From left to right, Clarkson Senior Vice President and Provost Chuck Thorpe; keynote speaker Renhe Jia, the global slurry technology director at Cabot Microelectronics; Clarkson Distinguished University Professor S.V. Babu; and keynote speaker Manabu Tsujimura, the chief technology officer of Ebara Corporation in Japan.

cmp3-2016.jpg: CMP symposium organizers. Front row, left to right: Manabu Tsujimura, Ebara, Japan; Raghu Patlolla, IBM; Hirokuni Hiyama, Ebara, Japan; and Arthur Chen, NTUST, Taiwan. Back row, left to right: Dinesh Koli, Globalfoundries; Gautam Banerjee, represents Air Products and the CMP User’s Group; Lee Cook, Dow Electronic Materials; Daniel Redfield, Applied Materials; and Clarkson Distinguished University Professor S.V. Babu.

[News directors and editors: For more information, contact Annie Harrison, Director of Media Relations, at 315-268-6764 or]

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