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21st International Symposium on Chemical-Mechanical Planarization

In this Section

List of Posters

1. Recent Advances in Copper and Cobalt Post CMP Cleaning, Michael White, Daniela White, Volley Wang, Elizabeth Thomas, Jun Liu, Don Frye and Ruben Lieten, Entegris, Inc.

2. Challenges and Solutions for Post-CMP Cleaning of Tungsten and Dielectric Surfaces, Daniela White, Thomas Parson, Ruben Lieten, and Michael White, Entegris Inc.

3. Tribo-Electrochemical Examination of Glycine as a Complexing Agent for Potential Application in Abrasive-Free CMP of Cobalt, Cody Johnson, Shen Wei and Dipankar Roy, Clarkson University

4. Experimental Considerations for using Tribo-Electrochemical Measurements to Study Metal CMP Systems, Cody Johnson, Shen Wei and Dipankar Roy,Clarkson University

5. Measuring and Controlling the Rates of Tribo-Corrosion at a Pad-Metal Interface in CMP, Shen Wei, Cody Johnson and Dipankar Roy, Clarkson University

6. Surface Chemistry of Ceria Nanoparticles for CMP applications, Jihoon Seo,1,2, Akshay Gowda K M,1 Ungyu Paik,2,* and S.V. Babu1; 1Center for Advanced Materials Processing, Clarkson University, 2WCD Department of Energy Eng., Hanyang University, Seoul, South Korea

7. Ammonia-peroxide water mixture (APM) Cleaning Solution for Superfine CeO2 NPs: Their Understanding and Optimization, Jihoon Seo,1,2 Akshay Gowda K M,1 Ungyu Paik,2, * and S.V. Babu1, 1Center for Advanced Materials Processing, Clarkson University,2WCD Department of Energy Engineering, Hanyang University, Seoul, South Korea

8. Effect of Deposition Methods on Material Removal Rate During Nickel CMP, Yanni Wang1,2, Lieve Teugels1, Kevin Vandersmissen1, Stefan De Gendt1, Herbert Struyf1, Sitaraman Krishnan2; 1 imec, Kapeldreef 75, Heverlee, Belgium, 2 Clarkson University

9. Detachment of inhalable particles: experimental study using a high-speed wind tunnel, in-situ microscopy, Jing Qian1, Babak Nasr1, Meilu He1, Kavindra Kumaragama1, Matthew Brown1, Morgan Minyard3, Andrea Ferro2, Goodarz Ahmadi1, Suresh Dhaniyala1; 1Department of Mechanical & Aeronautical Eng., Clarkson University, 2Department of Civil & Environmental Eng., Clarkson University, 3Defense Threat Reduction Agency (DTRA), Fort Belvoir, VA

10. Citric acid as a complexing agent in chemical mechanical polishing slurries for cobalt films for interconnect applications, R. Popuria, K.V. Sagia, S. R. Aletya, B.C. Peethalab, H. Amanapub, R. Patlollab, and S.V. Babua ; aCenter for Advanced Materials Processing, Clarkson University, bIBM Corporation

11. Chemical mechanical polishing (CMP) of cobalt-containing substrate and post CMP solution for cobalt barriers; K. V. Sagi1 , L. G. Teugels2 , M. H. van der Veen2 , Herbert Struyf2 , S. R. Alety1 , U. R. K. Lagudu1 , R. Popuri1 , R. Patlolla3 , C. V. V. S. Surisetty3 , C. K. Ranaweera1 , and S. V. Babu1; 1Center for Advanced Materials Processing, Clarkson University; 2IMEC, 3001 Leuven, Belgium; 3IBM Corporation

12. Role of Ce (III) Ions in Achieving High Silicon Nitride Polish Rates, Sridevi R Alety, Kaushik Sagi, Nandan Baradonahilli and S.V. Babu; Center for Advanced Materials Processing, Clarkson University

13. Recyclable Nanosorbent for Treatment and Management of Eutrophication in Environmental Waters, Ali Othmana, Eduard Dumitrescua, Nandan Baradanahalli K.b , S. V. Babub,c and Silvana Andreescua, aDepartment of Chemistry and Biomolecular Science, bDepartment of Chemical and Biomolecular Engineering, and cCenter for Advanced Materials Processing, Clarkson University


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August 13-16, 2017

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