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CMP Meeting 2013

In this Section
Symposium on Chemical Mechanical Planarization  
August 11-14, 2013
Crown Plaza Resort


CMP Meeting 2013 Presentations (Password required)

August 11:

12:00 - 5:00 P.M. Hotel and CAMP Registration

5:45 - 7:15 P.M. Cocktail Reception, Adirondack Great Room

Monday, August 12:

7:00- 8:10 AM Breakfast – MacKenzie’s


8:00 A.M. S. V. Babu: Opening Remarks.

Session I

8:05 A.M. Scaling and CMP Challenges -- Abhinav Tripathi (Intel)

8:30 A.M. Equipment and Material Design for Advanced Polish Process Capability . – Rixin Peng (Applied Materials)

8:55 A.M. BEOL CMP Challenges for Advanced Technology Nodes -- Kunal Tanwar (GLOBALFOUNDRIES)

9:20 A.M. CMP Challenges in FinFET Technology -- Charan Surisetty (IBM)

9:45 A.M. Coffee Break

Session II

10:10 A.M. High Selectivity Silicon Nitride Slurry for Advanced Technology Node Front End CMP Applications -- James Schlueter and James Henry (Air Products)

10:35 A.M. Silicon Nitride Slurry with Tunable Selectivity to Silicon Oxide -- Luling Wang, Toshiyuki Saie, Abhudaya Mishra, and Richard Wen, (FUJIFILM Planar Solutions, LLC)

11:00 A.M. High and Low Selectivity Slurries for Silicon Carbonitride CMP -- Hooi-Sung Kim, Fusayo Saeki and Anne Miller (Fujimi)

11:25 A.M. Top Productivity Issues for Consortia Fabs & Lean Six Sigma Solution Validation -- Boyd Finlay (Sematech)

11:50 A.M. CMP Slurry Delivery – Control Systems -- Paul Safier (Intel)

12:15 P.M. Lunch – MacKenzie’s

Session III: Chair:Bo Un Yoon (Samsung)

3:45 P.M. Planning CMP Experiments for Maximum Information at Minimum Cost -- Robert Rhoades (Entrepix, Inc.)

4:10 P.M. CMP Characterization Consortia: A Proposal for Cost-Effective, Rapid Screening & Prototyping of CMP Consumables -- Michael Wedlake (GLOBALFOUNDRIES)

Monday, August 12 continued:

4:35 P.M. Nanoparticle Detection and Analysis -- Panart Khajornrungruang (Kyushu Institute of Technology & Clarkson)

5:00 P.M. New Developments in Analytical Methods for CMP Slurries, including Optical and Nuclear Magnetic Resonance Techniques -- Ian Herzberg (Particle Sizing Systems)

5:25 P.M. Understanding Mutual Dynamic Interaction Among Abrasive, Polymer, and Polyuretane Pad -- Jinok Moon (Samsung Electronics Co. Ltd.)

5:45 - 7:00 P.M. Poster Session / Open Bar – Grand View A

Poster Session will be in Memory of Professor Yuzhuo Li and his Contributions

It is being sponsored by "Particle Sizing Systems"

7:00 P.M. Dinner – Olympic Room

After Dinner Speaker: The Silicon Process Roadmap - Where is it taking us? --Mark Dougherty (IBM) Director- Unit Process Development, SRDC-IBM Microelectronics Division

Tuesday, August 13:

7:00 - 8:00 A.M. Breakfast – MacKenzie’s

Session IV

8:00 A.M. Global 450 mm Consortium (G450C) Overview -- Gregory Akiki (IBM, G450C)

8:25 A.M. More Moore and More than Moore in CMP -- Paul Feeney (Axustech)

8:50 A.M. Hybrid Energy Process Model Analysis of Cu CMP -- C-C.Arthur Chen (National Taiwan University of Science & Technology)

9:15 A.M. Polishing Characteristics of Manganese Slurry in Glass substrate and SiC Wafer -- Syuhei Kurokawa (Kyushu University)

9:40 A.M. Study on Material Removal Phenomena in SiO2-CMP Process -- Keisuke Suzuki (Kyushu Institute of Technology)

10:05 A.M. Coffee Break

Session V

10:30 A.M. A Test Methodology for Comparing the Performance of CMP Conditioners – Dave Slutz (Morgan Advanced Materials)

10:55 A.M. A Tunable CMP Pad Conditioner Design for Advanced Applications -- R.K. Singh, P.Doering, A.Galpin, D.Wells and C. Vroman (Entegris)

11:20 A.M. Influence of Traverse Speed and Surface Wettability on the Friction of PVA Brush for Post CMP Cleaning --Toshiyuki Sanada (Shizuoka University)

11:45 A.M. A Review of Methods, Equipment and Model Dispersions for Evaluating the Performance of Filters for CMP Slurries -- Patrick Connor (Pall)

12:10 P.M. Lunch – MacKenzie’s

Tuesday, August 13 continued:

Session VI

4:00 P.M Nanoabrasive-based Slurries for Next Generation CMP Applications -- Sri Sai Vegunta (Micron)

4:20 P.M. A Novel Polystyrene-SiO2 Composite Nanoparticle for Slurry Abrasives -- Taesung Kim (SKKU)

4:45 P.M. Re-examination of Non-Prestonian Effects in Patterned Wafer CMP --Naresh Penta, Lee Cook, and Arun Reddy (Dow Electronic Materials)

5:10 P.M. Recent Developments in Advanced Dielectrics Slurries -- Renhe Jia (Cabot)

5:35 P.M. FEOL III-V Development: CMP Needs and Opportunities -- Richard Hill (SEMATECH)

6:00 P.M. Trolley Service for Dinner – Pick Up Location - Hotel Front Entrance

6:15 - 7:15 P.M. Reception at Golf House Restaurant, Lake Placid Club

7:15 P.M. Dinner – Golf House Restaurant, Lake Placid Club

After Dinner: S.V. Babu, Introduction

Award and Recognition for John Prendergast

Wednesday, August 14:

7:00 - 8:00 A.M. Breakfast – MacKenzie’s

Session VII

8:05 A.M. Modeling of Droplet Evaporation on Si-wafers -- Satomi Hamada (Ebara Corporation)

8:30 A.M Quantitative Surface Studies of Additive Adsorption on Abrasive Particles in CMP Slurry -- Yi Guo, Kebede Beshah, Lee Cook (Dow Electronic Materials )

8:55 A.M. Tungsten CMP Defect Reduction by Process Optimization -- Raghava Kakireddy (Applied Materials)

9:20 A.M. An Alkaline Post CMP Clean Without Tetramethylammonium Hydroxide -- Yu Chi Fua, Wei Jung Chena, Wen Tsai Tsaia, Minghui Lua, Song Y. Chang, Wen Hao Wu, & Eric Wu (UWiZ Technology & United Microelectronics Co)

9:45 A.M. Non-Amine based Post Cu CMP Cleaning -- Jin-Goo Park (Hanyang University)

10:10 A.M. Coffee Break

Session VIII

10:35 A.M. Ru CMP -- Lieve Teugels (IMEC, Belgium)

11:00 A.M. Tantalum Damascene CMP Utilized in Magnetic Tunnel Junction Integration -- Matt Smalley (CNSE)

11:25 A.M. Mechanistic Evaluation of Nickel-Phosphorous (NiP) CMP -- Ken Rushing (Clarkson)

11:45 A.M. CMP of Silicon Carbide Films – Uma R.K. Lagudu and S.V. Babu (Clarkson)

12:10 P.M. Closing Remarks, S.V. Babu, CAMP


S. V. Babu, Clarkson University
Hirokuni Hiyama, EBARA
Jin-goo Park, Hanyang University
Charan Surisetty, IBM
Joseph Steigerwald, Intel
Matt Prince, Intel
Lee Cook, Dow Electronic Materials
Rajeev Bajaj, Applied Materials